Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515884 | Substrate having a conductive structure within photo-sensitive resin | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Li-Chuan Tsai, Chih-Cheng Lee | 2019-12-24 |
| 10483196 | Embedded trace substrate structure and semiconductor package structure including the same | — | 2019-11-19 |
| 10446411 | Semiconductor device package with a conductive post | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Tzu Peng | 2019-10-15 |
| 10224298 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Kuang-Hsiung Chen, Yu-Hsuan Tsai, Sheng-Ming Wang, Wun-Jheng Syu | 2019-03-05 |