Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157763 | High throughput substrate handling endstation and sequence | Robert J. Mitchell, Eric D. Hermanson | 2018-12-18 |
| 10103046 | Buffer chamber wafer heating mechanism and supporting robot | William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Paul E. Pergande | 2018-10-16 |
| 9863032 | Techniques for processing a substrate | Kevin M. Daniels, Russell J. Low, Nicholas P. T. Bateman | 2018-01-09 |