Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157763 | High throughput substrate handling endstation and sequence | Robert J. Mitchell, Benjamin B. Riordon | 2018-12-18 |
| 10119529 | Cryopump arrangement for improved pump speed | Steven C. Borichevsky | 2018-11-06 |
| 9978554 | Dual cathode ion source | Bon-Woong Koo, Jun Lu, Frank Sinclair, Joseph E. Pierro, Michael D. Johnson +2 more | 2018-05-22 |