Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10164066 | FinFET devices and methods of forming | Huicheng Chang, Liang-Yin Chen | 2018-12-25 |
| 10141266 | Method of fabricating semiconductor package structure | Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun +1 more | 2018-11-27 |
| 10128368 | Double gate trench power transistor and manufacturing method thereof | Po-Hsien Li, Jia-Fu Lin, Wei-Chieh Lin | 2018-11-13 |
| 10068842 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-09-04 |
| 10043757 | Semiconductor package structure and method of fabricating the same | Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun +1 more | 2018-08-07 |
| 10002825 | Method of fabricating package structure with an embedded electronic component | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-06-19 |
| 9991197 | Fabrication method of semiconductor package | Chi-Ching Ho, Shao-Tzu Tang, Yu Liu, Ying-Chou Tsai | 2018-06-05 |
| 9922827 | Method of forming a semiconductor structure | Liang-Gi Yao, Ta-Ming Kuan, Jeff J. Xu, Clement Hsingjen Wann | 2018-03-20 |
| 9899249 | Fabrication method of coreless packaging substrate | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-02-20 |
| 9893160 | Methods of forming gate dielectric material | Liang-Gi Yao, Clement Hsingjen Wann | 2018-02-13 |