Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991197 | Fabrication method of semiconductor package | Chia-Cheng Chen, Chi-Ching Ho, Shao-Tzu Tang, Yu Liu | 2018-06-05 |
| 9978673 | Package structure and method for fabricating the same | Shao-Tzu Tang, Jia-Fong Yeh, Chien-Hui Wang, Chung-Yan Huang | 2018-05-22 |
| 9899235 | Fabrication method of packaging substrate | Chi-Ching Ho, Sheng-Che Huang | 2018-02-20 |