Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991197 | Fabrication method of semiconductor package | Chia-Cheng Chen, Chi-Ching Ho, Yu Liu, Ying-Chou Tsai | 2018-06-05 |
| 9978673 | Package structure and method for fabricating the same | Jia-Fong Yeh, Chien-Hui Wang, Chung-Yan Huang, Ying-Chou Tsai | 2018-05-22 |