Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899235 | Fabrication method of packaging substrate | Chi-Ching Ho, Ying-Chou Tsai | 2018-02-20 |
| 9867303 | Modular circuit device | Yu-Tse Liu, Wei Hu, Chien-Hung Lee | 2018-01-09 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899235 | Fabrication method of packaging substrate | Chi-Ching Ho, Ying-Chou Tsai | 2018-02-20 |
| 9867303 | Modular circuit device | Yu-Tse Liu, Wei Hu, Chien-Hung Lee | 2018-01-09 |