| 10141266 |
Method of fabricating semiconductor package structure |
Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Tzu-Chieh Shen +1 more |
2018-11-27 |
| 10096491 |
Method of fabricating a packaging substrate including a carrier having two carrying portions |
Yu-Cheng Pai, Chun-Hsien Lin, Wei-Chung Hsiao, Liang-Yi Hung |
2018-10-09 |
| 10068842 |
Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same |
Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Tzu-Chieh Shen +1 more |
2018-09-04 |
| 10043757 |
Semiconductor package structure and method of fabricating the same |
Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Tzu-Chieh Shen +1 more |
2018-08-07 |
| 10002825 |
Method of fabricating package structure with an embedded electronic component |
Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Tzu-Chieh Shen +1 more |
2018-06-19 |
| 9905438 |
Method of manufacturing package substrate and semiconductor package |
Chun-Hsien Lin, Tzu-Chieh Shen, Shih-Chao Chiu, Yu-Cheng Pai |
2018-02-27 |
| 9899249 |
Fabrication method of coreless packaging substrate |
Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Tzu-Chieh Shen +1 more |
2018-02-20 |