Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096491 | Method of fabricating a packaging substrate including a carrier having two carrying portions | Yu-Cheng Pai, Chun-Hsien Lin, Wei-Chung Hsiao, Ming-Chen Sun | 2018-10-09 |