Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141266 | Method of fabricating semiconductor package structure | Yu-Cheng Pai, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-11-27 |
| 10109572 | Method for fabricating package structure | — | 2018-10-23 |
| 10096491 | Method of fabricating a packaging substrate including a carrier having two carrying portions | Yu-Cheng Pai, Chun-Hsien Lin, Ming-Chen Sun, Liang-Yi Hung | 2018-10-09 |
| 10068842 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-09-04 |
| 10043757 | Semiconductor package structure and method of fabricating the same | Yu-Cheng Pai, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-08-07 |
| 10025945 | Decryption method for use in displaying data | — | 2018-07-17 |
| 10002825 | Method of fabricating package structure with an embedded electronic component | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-06-19 |
| 9899249 | Fabrication method of coreless packaging substrate | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-02-20 |