Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141266 | Method of fabricating semiconductor package structure | Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun +1 more | 2018-11-27 |
| 10068842 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-09-04 |
| 10043757 | Semiconductor package structure and method of fabricating the same | Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun +1 more | 2018-08-07 |
| 10002825 | Method of fabricating package structure with an embedded electronic component | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-06-19 |
| 9905438 | Method of manufacturing package substrate and semiconductor package | Ming-Chen Sun, Chun-Hsien Lin, Shih-Chao Chiu, Yu-Cheng Pai | 2018-02-27 |
| 9899249 | Fabrication method of coreless packaging substrate | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-02-20 |