Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096541 | Method for fabricating electronic package | Ching-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih | 2018-10-09 |
| 10014641 | Crimping apparatus and system for crimping a flexible printed circuit | Tung-Sheng Chen, Chih-Cheng Chuang | 2018-07-03 |
| 9899309 | Electronic package and semiconductor substrate | Shih-Liang Peng, Chieh-Lung Lai, Jia-Wei Pan, Chang-Lun Lu | 2018-02-20 |
| 9875949 | Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof | Hsiao-Chun Huang, Hsien-Wen Chen, Guang-Hwa Ma | 2018-01-23 |