Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9875949 | Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof | Hsien-Wen Chen, Shih-Ching Chen, Guang-Hwa Ma | 2018-01-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9875949 | Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof | Hsien-Wen Chen, Shih-Ching Chen, Guang-Hwa Ma | 2018-01-23 |