Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049973 | Electronic package and fabrication method thereof and substrate structure | Ching-Wen Chiang, Kuang-Hsin Chen | 2018-08-14 |
| 9875949 | Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof | Hsiao-Chun Huang, Shih-Ching Chen, Guang-Hwa Ma | 2018-01-23 |