Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096541 | Method for fabricating electronic package | Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen | 2018-10-09 |
| 10096558 | Multi-band antenna package structure, manufacturing method thereof and communication device | Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu | 2018-10-09 |
| 10049973 | Electronic package and fabrication method thereof and substrate structure | Kuang-Hsin Chen, Hsien-Wen Chen | 2018-08-14 |
| 9899344 | Substrate structure, fabrication method thereof and conductive structure | Hsin-Ta Lin | 2018-02-20 |