Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141233 | Electronic package and fabrication method thereof | Lu-Yi Chen | 2018-11-27 |
| 10128178 | Electronic package and method for fabricating the same | Lu-Yi Chen, Hung-Yuan Li, Chieh-Lung Lai, Shih-Liang Peng | 2018-11-13 |
| 9899309 | Electronic package and semiconductor substrate | Shih-Ching Chen, Shih-Liang Peng, Chieh-Lung Lai, Jia-Wei Pan | 2018-02-20 |