Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128178 | Electronic package and method for fabricating the same | Lu-Yi Chen, Hung-Yuan Li, Shih-Liang Peng, Chang-Lun Lu | 2018-11-13 |
| 9899309 | Electronic package and semiconductor substrate | Shih-Ching Chen, Shih-Liang Peng, Jia-Wei Pan, Chang-Lun Lu | 2018-02-20 |