Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Chih-Hsien Chiu, Hao-Ju Fang, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2018-09-11 |
| 10062582 | Fabrication method of package having ESD and EMI preventing functions | Tsung-Hsien Tsai, Chih-Hsien Chiu, Chien-Cheng Lin | 2018-08-28 |
| 9997477 | Method of manufacturing semiconductor package | Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Chih-Hsien Chiu, Yude Chu | 2018-06-12 |
| 9907186 | Electronic package structure and method for fabricating the same | Chih-Hsien Chiu, Chen-Wen Huang, Wen-Jung Tsai, Jia-Huei Hung, Fu-Tang Huang | 2018-02-27 |
| 9899335 | Method for fabricating package structure | Chih-Hsien Chiu, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang | 2018-02-20 |