Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2018-09-11 |