Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai +1 more | 2018-09-11 |
| 10074621 | Electronic package with antenna structure | Chih-Hsien Chiu, Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai | 2018-09-11 |
| 9999132 | Electronic package | Chih-Hsien Chiu, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai | 2018-06-12 |
| 9899335 | Method for fabricating package structure | Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Chao-Ya Yang | 2018-02-20 |