Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2018-09-11 |
| 9899335 | Method for fabricating package structure | Chih-Hsien Chiu, Hsin-Lung Chung, Chia-Yang Chen, Chao-Ya Yang | 2018-02-20 |