Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2018-09-11 |
| 10074621 | Electronic package with antenna structure | Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai, Chia-Yang Chen | 2018-09-11 |
| 10062582 | Fabrication method of package having ESD and EMI preventing functions | Tsung-Hsien Tsai, Hsin-Lung Chung, Chien-Cheng Lin | 2018-08-28 |
| 9999132 | Electronic package | Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai | 2018-06-12 |
| 9997477 | Method of manufacturing semiconductor package | Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Hsin-Lung Chung, Yude Chu | 2018-06-12 |
| 9907186 | Electronic package structure and method for fabricating the same | Chen-Wen Huang, Hsin-Lung Chung, Wen-Jung Tsai, Jia-Huei Hung, Fu-Tang Huang | 2018-02-27 |
| 9899335 | Method for fabricating package structure | Hsin-Lung Chung, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang | 2018-02-20 |