Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9907186 | Electronic package structure and method for fabricating the same | Chih-Hsien Chiu, Chen-Wen Huang, Hsin-Lung Chung, Wen-Jung Tsai, Jia-Huei Hung | 2018-02-27 |
| 9900996 | Package substrate and structure | Chang-Fu Lin, Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu | 2018-02-20 |