Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062651 | Packaging substrate and electronic package having the same | Fang-Yu Liang, Hung-Hsien Chang, Yi-Che Lai | 2018-08-28 |
| 9900996 | Package substrate and structure | Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu, Fu-Tang Huang | 2018-02-20 |