Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062651 | Packaging substrate and electronic package having the same | Hung-Hsien Chang, Yi-Che Lai, Chang-Fu Lin | 2018-08-28 |
| 10049975 | Substrate structure | Hung-Hsien Chang, Yi-Che Lai, Wen-Tsung Tseng, Chen-Yu Huang | 2018-08-14 |