Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062651 | Packaging substrate and electronic package having the same | Fang-Yu Liang, Hung-Hsien Chang, Chang-Fu Lin | 2018-08-28 |
| 10049975 | Substrate structure | Fang-Yu Liang, Hung-Hsien Chang, Wen-Tsung Tseng, Chen-Yu Huang | 2018-08-14 |
| 9899308 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Shih-Kuang Chiu, Mao-Hua Yeh | 2018-02-20 |
| 9875981 | Semiconductor device having conductive vias | Meng-Tsung Lee, Shih-Kuang Chiu | 2018-01-23 |