Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049955 | Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer | Chiang-Cheng Chang, Jung-Pang Huang, Shih-Kuang Chiu | 2018-08-14 |
| 9899237 | Carrier, semiconductor package and fabrication method thereof | Chiang-Cheng Chang, Jung-Pang Huang, Shih-Kuang Chiu | 2018-02-20 |
| 9875981 | Semiconductor device having conductive vias | Yi-Che Lai, Shih-Kuang Chiu | 2018-01-23 |