Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049955 | Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer | Chiang-Cheng Chang, Meng-Tsung Lee, Shih-Kuang Chiu | 2018-08-14 |
| 9899237 | Carrier, semiconductor package and fabrication method thereof | Chiang-Cheng Chang, Meng-Tsung Lee, Shih-Kuang Chiu | 2018-02-20 |