Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049955 | Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang | 2018-08-14 |
| 9991178 | Interposer and electrical testing method thereof | Lu-Yi Chen, Chi-Hsin Chiu | 2018-06-05 |
| 9899237 | Carrier, semiconductor package and fabrication method thereof | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang | 2018-02-20 |
| 9899308 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Yi-Che Lai, Mao-Hua Yeh | 2018-02-20 |
| 9875981 | Semiconductor device having conductive vias | Meng-Tsung Lee, Yi-Che Lai | 2018-01-23 |