Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163771 | Interposer device including at least one transistor and at least one through-substrate via | Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more | 2018-12-25 |
| 10158030 | CMOS and bipolar device integration including a tunable capacitor | Gengming Tao, Richard Hammond, Ranadeep Dutta, Matthew Michael Nowak, Francesco Carobolante | 2018-12-18 |
| 10157823 | High density fan out package structure | Dong Wook Kim, Hong Bok We, Jae Sik Lee | 2018-12-18 |
| 10141908 | Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance | Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez +1 more | 2018-11-27 |
| 10103135 | Backside ground plane for integrated circuit | Chengjie Zuo, Jonghae Kim, David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte +1 more | 2018-10-16 |
| 10044390 | Glass substrate including passive-on-glass device and semiconductor die | Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim +1 more | 2018-08-07 |
| 10038422 | Single-chip multi-frequency film bulk acoustic-wave resonators | Changhan Hobie Yun, Je-Hsiung Lan, Chengjie Zuo, David Francis Berdy, Jonghae Kim +2 more | 2018-07-31 |
| 9941156 | Systems and methods to reduce parasitic capacitance | Vidhya Ramachandran, Christine Hau-Riege, John Jianhong Zhu, Jeffrey Junhao Xu, Jihong Choi +2 more | 2018-04-10 |
| 9922956 | Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration | Je-Hsiung Lan, Wenyue Zhang, Yang Du, Yong Ju Lee, Jing Xie | 2018-03-20 |
| 9881859 | Substrate block for PoP package | Hong Bok We, Dong Wook Kim, Jae Sik Lee, Ratibor Radojcic | 2018-01-30 |