Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922956 | Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration | Je-Hsiung Lan, Yang Du, Yong Ju Lee, Shiqun Gu, Jing Xie | 2018-03-20 |