Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121743 | Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC) | Pratyush Kamal, Kambiz Samadi, Yang Du | 2018-11-06 |
| 9929733 | Connection propagation for inter-logical block connections in integrated circuits | Pratyush Kamal, Kambiz Samadi, Yang Du | 2018-03-27 |
| 9922956 | Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration | Je-Hsiung Lan, Wenyue Zhang, Yang Du, Yong Ju Lee, Shiqun Gu | 2018-03-20 |