Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121743 | Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC) | Pratyush Kamal, Kambiz Samadi, Jing Xie | 2018-11-06 |
| 10062680 | Silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) standard library cell circuits having a gate back-bias rail(s), and related systems and methods | Pratyush Kamal | 2018-08-28 |
| 10038060 | Graphene NMOS transistor using nitrogen dioxide chemical adsorption | Yong Ju Lee | 2018-07-31 |
| 10005631 | Lateral positioning device for a sheet element | Pierre-Frédéric Collomb, Daniel Hermann, David Guillaume-Gentil | 2018-06-26 |
| 9929733 | Connection propagation for inter-logical block connections in integrated circuits | Pratyush Kamal, Kambiz Samadi, Jing Xie | 2018-03-27 |
| 9922956 | Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration | Je-Hsiung Lan, Wenyue Zhang, Yong Ju Lee, Shiqun Gu, Jing Xie | 2018-03-20 |
| 9869713 | Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems | Sung Kyu Lim, Ratibor Radojcic | 2018-01-16 |