Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9881859 | Substrate block for PoP package | Hong Bok We, Dong Wook Kim, Jae Sik Lee, Shiqun Gu | 2018-01-30 |
| 9869713 | Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems | Sung Kyu Lim, Yang Du | 2018-01-16 |