| 10163771 |
Interposer device including at least one transistor and at least one through-substrate via |
Changhan Hobie Yun, David Francis Berdy, Niranjan Sunil Mudakatte, Mario Francisco Velez, Shiqun Gu +1 more |
2018-12-25 |
| 10154591 |
Passive device assembly for accurate ground plane control |
David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Jonghae Kim |
2018-12-11 |
| 10141353 |
Passive components implemented on a plurality of stacked insulators |
Changhan Hobie Yun, Daeik Daniel Kim, Jonghae Kim, Mario Francisco Velez, David Francis Berdy |
2018-11-27 |
| 10141908 |
Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance |
Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Shiqun Gu, Mario Francisco Velez +1 more |
2018-11-27 |
| 10103703 |
Double-sided circuit |
Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim, Jonghae Kim, Mario Francisco Velez +2 more |
2018-10-16 |
| 10103135 |
Backside ground plane for integrated circuit |
Jonghae Kim, David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more |
2018-10-16 |
| 10103116 |
Open-passivation ball grid array pads |
Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, David Francis Berdy, Jonghae Kim +1 more |
2018-10-16 |
| 10074625 |
Wafer level package (WLP) ball support using cavity structure |
Mario Francisco Velez, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim, Daeik Daniel Kim +3 more |
2018-09-11 |
| 10069474 |
Encapsulation of acoustic resonator devices |
Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte, Je-Hsiung Lan +4 more |
2018-09-04 |
| 10049815 |
Nested through glass via transformer |
Daeik Daniel Kim, Jonghae Kim, Mario Francisco Velez, Changhan Hobie Yun |
2018-08-14 |
| 10044390 |
Glass substrate including passive-on-glass device and semiconductor die |
Changhan Hobie Yun, Mario Francisco Velez, Niranjan Sunil Mudakatte, Shiqun Gu, Jonghae Kim +1 more |
2018-08-07 |
| 10039188 |
Two-stage power delivery architecture |
Changhan Hobie Yun, Francesco Carobolante, Jonghae Kim, Mario Francisco Velez, Lawrence D. Smith +1 more |
2018-07-31 |
| 10038422 |
Single-chip multi-frequency film bulk acoustic-wave resonators |
Changhan Hobie Yun, Je-Hsiung Lan, David Francis Berdy, Jonghae Kim, Mario Francisco Velez +2 more |
2018-07-31 |
| 10026546 |
Apparatus with 3D wirewound inductor integrated within a substrate |
Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim +1 more |
2018-07-17 |
| 9966426 |
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications |
Niranjan Sunil Mudakatte, Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +3 more |
2018-05-08 |
| 9959964 |
Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications |
Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim, Jonghae Kim, Je-Hsiung Lan +2 more |
2018-05-01 |
| 9954267 |
Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter |
Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez, David Francis Berdy, Jonghae Kim |
2018-04-24 |
| 9935166 |
Capacitor with a dielectric between a via and a plate of the capacitor |
Je-Hsiung Lan, Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim, Robert Paul Mikulka +2 more |
2018-04-03 |
| 9930783 |
Passive device assembly for accurate ground plane control |
David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Jonghae Kim |
2018-03-27 |
| 9906318 |
Frequency multiplexer |
Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan, Robert Paul Mikulka +5 more |
2018-02-27 |
| 9893048 |
Passive-on-glass (POG) device and method |
Je-Hsiung Lan, Niranjan Sunil Mudakatte, Changhan Hobie Yun, Daeik Daniel Kim, David Francis Berdy +2 more |
2018-02-13 |
| 9876513 |
LC filter layer stacking by layer transfer to make 3D multiplexer structures |
Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte +1 more |
2018-01-23 |
| 9875848 |
MIM capacitor and method of making the same |
David Francis Berdy, Daeik Daniel Kim, Niranjan Sunil Mudakatte, Je-Hsiung Lan, Changhan Hobie Yun +2 more |
2018-01-23 |