| 10103703 |
Double-sided circuit |
Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Jonghae Kim +2 more |
2018-10-16 |
| 10074625 |
Wafer level package (WLP) ball support using cavity structure |
Mario Francisco Velez, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim, Chengjie Zuo +3 more |
2018-09-11 |
| 10069474 |
Encapsulation of acoustic resonator devices |
Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte +4 more |
2018-09-04 |
| 9966426 |
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications |
Niranjan Sunil Mudakatte, Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +3 more |
2018-05-08 |
| 9935166 |
Capacitor with a dielectric between a via and a plate of the capacitor |
Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim +2 more |
2018-04-03 |
| 9906318 |
Frequency multiplexer |
Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +5 more |
2018-02-27 |
| 9876513 |
LC filter layer stacking by layer transfer to make 3D multiplexer structures |
Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez +1 more |
2018-01-23 |