Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2018-12-25 |
| 10068875 | Apparatuses and methods for heat transfer from packaged semiconductor die | — | 2018-09-04 |
| 10008395 | Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill | William R. Stephenson | 2018-06-26 |
| 9960148 | Methods for transferring heat from stacked microfeature devices | Salman Akram | 2018-05-01 |