Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062608 | Semiconductor devices comprising nickel- and copper-containing interconnects | James M. Wark, William M. Hiatt | 2018-08-28 |
| 10050180 | LED with stress-buffer layer under metallization layer | Quanbo Zou | 2018-08-14 |
| 10002941 | Hybrid gate dielectrics for semiconductor power devices | Venkat Ananthan | 2018-06-19 |
| 9960148 | Methods for transferring heat from stacked microfeature devices | David R. Hembree | 2018-05-01 |
| 9935069 | Reducing solder pad topology differences by planarization | Jipu Lei, Stefano Schiaffino, Alexander H. Nickel, Mooi Guan Ng | 2018-04-03 |
| 9911769 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2018-03-06 |