Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9935069 | Reducing solder pad topology differences by planarization | Jipu Lei, Stefano Schiaffino, Alexander H. Nickel, Salman Akram | 2018-04-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9935069 | Reducing solder pad topology differences by planarization | Jipu Lei, Stefano Schiaffino, Alexander H. Nickel, Salman Akram | 2018-04-03 |