Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049869 | Composite dielectric interface layers for interconnect structures | Kapu Sirish Reddy, Shankar Swaminathan, Meliha Gozde Rainville, Frank L. Pasquale | 2018-08-14 |
| 10002787 | Staircase encapsulation in 3D NAND fabrication | Yongsik Yu, Bart J. van Schravendijk, Bhadri N. Varadarajan | 2018-06-19 |
| 9899234 | Liner and barrier applications for subtractive metal integration | Hui-Jung Wu, Thomas Knisley, Meihua Shen, John Hoang, Prithu Sharma | 2018-02-20 |
| 9859153 | Deposition of aluminum oxide etch stop layers | Meliha Gozde Rainville, Kapu Sirish Reddy, Dennis M. Hausmann | 2018-01-02 |