Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103105 | High density organic bridge device and method | Mihir K. Roy, Wei-Lun Kane Jen | 2018-10-16 |
| 9875969 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Johanna M. Swan, Sujit Sharan | 2018-01-23 |