Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847478 | Methods and apparatus for resistive random access memory (RRAM) | Ting-Chang Chang, Yong-En Syu, Fu-Yen Jian, Shih-Chieh Chang | 2017-12-19 |
| 9829806 | Lithography tool with backside polisher | Tang-Kuei Chang, Kuo-Hsiu Wei, Kei-Wei Chen, Huai-Tei Yang | 2017-11-28 |
| 9812569 | Semiconductor device and fabricating method thereof | I-Chih Chen, Chih-Mu Huang, Ying-Hao Chen, Wen-Chang Kuo, Jung-Chi Jeng | 2017-11-07 |
| 9812492 | Metal shield structure and methods for BSI image sensors | Shiu-Ko JangJian, Chi-Cherng Jeng, Volume Chien | 2017-11-07 |
| 9735231 | Block layer in the metal gate of MOS devices | Jung-Chih Tsao, Chi-Cheng Hung, Yu-Sheng Wang, Wen-Hsi Lee, Kei-Wei Chen | 2017-08-15 |
| 9735271 | Semiconductor device | Wen-Chu Hsiao, Lai-Wan Chong, Chun-Chieh Wang, Ying-Min Chou, Hsiang Hsiang Ko | 2017-08-15 |
| 9728598 | Semiconductor device having barrier layer to prevent impurity diffusion | I-Chih Chen, Chih-Mu Huang, Fu-Tsun Tsai, Meng-Yi Wu, Yung-Fa Lee | 2017-08-08 |
| 9728511 | Semiconductor wafer and semiconductor die | Hsi-Jung Wu, Volume Chien, Hsin-Chi Chen, Ying-Hao Chen, Hung-Ta Huang | 2017-08-08 |
| 9721984 | Image sensor manufacturing methods | Mu-Han Cheng, Kuo-Hsiu Wei, Kei-Wei Chen | 2017-08-01 |
| 9676114 | Wafer edge trim blade with slots | Chun-Ting Kuo, Kei-Wei Chen, Kuo-Hsiu Wei | 2017-06-13 |
| 9634119 | Semiconductor devices utilizing partially doped stressor film portions | Wen-Chu Hsiao, Ju Wen Hsiao, Ying-Min Chou, Hsiang Hsiang Ko | 2017-04-25 |
| 9620555 | Metal shielding layer in backside illumination image sensor chips and methods for forming the same | Shih-Chieh Chang, Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun +3 more | 2017-04-11 |
| 9566683 | Method for wafer grinding | Kuo-Hsiu Wei, Kei-Wei Chen, Chun-Ting Kuo | 2017-02-14 |
| 9570311 | Modular grinding apparatuses and methods for wafer thinning | Chun-Ting Kuo, Kei-Wei Chen, Kuo-Hsiu Wei | 2017-02-14 |