Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9676114 | Wafer edge trim blade with slots | Kei-Wei Chen, Ying-Lang Wang, Kuo-Hsiu Wei | 2017-06-13 |
| 9566683 | Method for wafer grinding | Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang | 2017-02-14 |
| 9570311 | Modular grinding apparatuses and methods for wafer thinning | Kei-Wei Chen, Ying-Lang Wang, Kuo-Hsiu Wei | 2017-02-14 |