Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9829806 | Lithography tool with backside polisher | Tang-Kuei Chang, Kuo-Hsiu Wei, Huai-Tei Yang, Ying-Lang Wang | 2017-11-28 |
| 9806154 | FinFET structure and method for manufacturing thereof | Chun Hsiung Tsai, Lai-Wan Chong, Chien-Wei Lee | 2017-10-31 |
| 9786707 | Image sensor isolation region and method of forming the same | Shiu-Ko JangJian, Min Hao Hong, Szu-An Wu | 2017-10-10 |
| 9735231 | Block layer in the metal gate of MOS devices | Jung-Chih Tsao, Chi-Cheng Hung, Yu-Sheng Wang, Wen-Hsi Lee, Ying-Lang Wang | 2017-08-15 |
| 9721984 | Image sensor manufacturing methods | Mu-Han Cheng, Kuo-Hsiu Wei, Ying-Lang Wang | 2017-08-01 |
| 9722081 | FinFET device and method of forming the same | Chun Hsiung Tsai, Chien-Tai Chan, Ziwei Fang, Huai-Tei Yang | 2017-08-01 |
| 9676114 | Wafer edge trim blade with slots | Chun-Ting Kuo, Ying-Lang Wang, Kuo-Hsiu Wei | 2017-06-13 |
| 9673244 | Image sensor isolation region and method of forming the same | Shiu-Ko JangJian, Min Hao Hong, Szu-An Wu | 2017-06-06 |
| 9627212 | Methods and systems for dopant activation using microwave radiation | Chun Hsiung Tsai, Huai-Tei Yang, Kuo-Feng Yu | 2017-04-18 |
| 9570311 | Modular grinding apparatuses and methods for wafer thinning | Chun-Ting Kuo, Ying-Lang Wang, Kuo-Hsiu Wei | 2017-02-14 |
| 9566683 | Method for wafer grinding | Kuo-Hsiu Wei, Ying-Lang Wang, Chun-Ting Kuo | 2017-02-14 |
| 9564513 | Epitaxy in semiconductor structure and manufacturing method thereof | Shih-Chieh Chang, Ying-Min Chou, Yi-Ming Huang, Chun-Ju Huang, Huai-Tei Yang | 2017-02-07 |
| 9536762 | Method and apparatus for thermal mapping and thermal process control | Chun Hsiung Tsai | 2017-01-03 |