Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812569 | Semiconductor device and fabricating method thereof | I-Chih Chen, Ying-Lang Wang, Chih-Mu Huang, Ying-Hao Chen, Wen-Chang Kuo | 2017-11-07 |
| 9728637 | Mechanism for forming semiconductor device with gate | I-Chih Chen, Wen-Chang Kuo, Ying-Hao Chen, Ru-Shang Hsiao, Chih-Mu Huang | 2017-08-08 |
| 9711468 | Bonding pad structure with dense via array | Tsung-Han Tsai, Yueh-Ching Chang, Volume Chien, Huang-Ta Huang, Chi-Cherng Jeng | 2017-07-18 |