Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711468 | Bonding pad structure with dense via array | Tsung-Han Tsai, Jung-Chi Jeng, Yueh-Ching Chang, Volume Chien, Chi-Cherng Jeng | 2017-07-18 |
HH
Huang-Ta Huang
Overall (2017): #397,117 of 506,227Top 80%
1
Patents 2017