Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711468 | Bonding pad structure with dense via array | Tsung-Han Tsai, Jung-Chi Jeng, Volume Chien, Huang-Ta Huang, Chi-Cherng Jeng | 2017-07-18 |
YC
Yueh-Ching Chang
Overall (2017): #183,985 of 506,227Top 40%
1
Patents 2017