Issued Patents 2017
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852899 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2017-12-26 |
| 9853102 | Tunnel field-effect transistor | Li-Ting Wang, Cheng-Tung Lin, De-Fang Chen, Chih-Tang Peng, Chien-Hsun Wang +1 more | 2017-12-26 |
| 9812358 | FinFET structures and methods of forming the same | Yen-Chun Huang, Ting-Ting Chen, Yu-Chung Su, Ling-Fu Nieh, Pin-Chuan Su +2 more | 2017-11-07 |
| 9805968 | Vertical structure having an etch stop over portion of the source | Cheng-Tung Lin, Li-Ting Wang, De-Fang Chen, Bing Chen, Huang-Yi Huang +3 more | 2017-10-31 |
| 9780214 | Semiconductor device including Fin- FET and manufacturing method thereof | Gin-Chen Huang, Tzu-Hsiang Hsu, Chia-Jung Hsu, Feng-Cheng Yang | 2017-10-03 |
| 9768024 | Multi-layer mask and method of forming same | Yung-Cheng Lu, Ying-Tsung Chen, Tien-I Bao | 2017-09-19 |
| 9768303 | Method and structure for FinFET device | Kuo-Yin Lin, Po-Yu Lin | 2017-09-19 |
| 9748109 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2017-08-29 |
| 9735107 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chia-Han Lai, Chi-Hsuan Ni, Cheng-Tung Lin +4 more | 2017-08-15 |
| 9680017 | Semiconductor device including Fin FET and manufacturing method thereof | Hung-Kun LO, Chia-Jung Hsu, Tzu-Hsiang Hsu, Feng-Cheng Yang, Ying-Ho Chen | 2017-06-13 |
| 9624576 | Systems and methods for gap filling improvement | Chi-Yuan Chen, Li-Ting Wang, Chun-I Tsai, Wei-Jung Lin, Huang-Yi Huang +2 more | 2017-04-18 |
| 9614054 | Method of forming a vertical device | De-Fang Chen, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang +1 more | 2017-04-04 |
| 9592585 | System and method for CMP station cleanliness | Kuo-Yin Lin, Wan-Chun Pan, Hsiang-Pi Chang, Chi-Yuan Chang | 2017-03-14 |
| 9577093 | Vertical structure and method of forming semiconductor device | Cheng-Tung Lin, Li-Ting Wang, De-Fang Chen, Bing Chen, Huang-Yi Huang +3 more | 2017-02-21 |
| 9567493 | CMP slurry solution for hardened fluid material | Kuo-Yin Lin, Wen-Kuei Liu, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2017-02-14 |
| 9559021 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2017-01-31 |