Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852899 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien +2 more | 2017-12-26 |
| 9748109 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2017-08-29 |
| 9567493 | CMP slurry solution for hardened fluid material | Kuo-Yin Lin, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2017-02-14 |
| 9559021 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien +2 more | 2017-01-31 |