Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852899 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2017-12-26 |
| 9748109 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou +3 more | 2017-08-29 |
| 9604340 | Carrier head having abrasive structure on retainer ring | — | 2017-03-28 |
| 9597771 | Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system | Hsin-Hsien Lu | 2017-03-21 |
| 9567493 | CMP slurry solution for hardened fluid material | Kuo-Yin Lin, Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien +1 more | 2017-02-14 |
| 9559021 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2017-01-31 |